Ref No Country Participating Company / Organisation Short name Partner Profile
1 France Alcatel Thales III-V Lab AT35Lab IND
2 France CNRS IEMN RES
3 Austria Austria Technische Universität Wien - Institute Für Festkorperelektronik TUW HE
4 Slovakia Slovakia Institute of Electrical Engineering Slovak Academy of Sciences IEE RES
5 Germany Germany Aixtron AG AIXTRON IND
6 Switzerland Switzerland Ecole Polytechnique Fédérale de Lausanne EPFL HE
7 Greece Foundation for Research and Technology - HELLAS FORTH RES
8 Germany Germany University of Ulm TUU HE
Ref
No		 Technique Hetero-structure Characterisation (Fat HEMT) Microwave Processing Advanced Passivation Thermal
Study		 Electrical Validation Managemen t
&
Coordinatio n
1 MOCVD InAlN/GaN SH
ü		     3D-Thermal simulation
Thermal  metrology Packaging		  
ü
2         Electrostatic simulation   Breakdown characterisation
S-Parameters
Load-Pull		  
3    
ü		   Passivation characterisation Lag characterisation Metrology Breakdown Characterisation  
4       Passivation
for TUU		 Passivation Study (Si3N4, Al2O3, etc)      
5 MOCVD GaN Buffer
for MBE, InAlN/GaN SH		            
6 MOCVD InAlN/GaN
SH & DH		 ü          
7 MBE InAlN/GaN
SH & DH		 ü          
8       Advanced Processing        
Overview of
Participants
role and profile
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